Capability
Capability for Rigid PCB
Item | Normal | Speciality |
Max.Layer count | 40L | 52L |
HDI Structure | 1+N+1 2+N+2 3+N+3 4+N+4 …. Anylayer | N/A |
Max.Single/Array Size | 1500mm*700mm | 2000*800mm |
Min.Finished Board Thickness | 2L: 0.15mm 4L: 0.30 mm | N/A |
Max.Finished Board Thickness | 6.50mm | 8.00mm |
Min.Core Thickness | 0.04mm | 0.03mm |
Min.Cu Thickness(Based) | 8um (1/4 oz) | 6um (1/5 oz) |
Max.Cu Thickness(Based) | 450um (15 oz) | 510um (17 oz) |
Min. Mechanical Drill Size | 0.15mm | 0.127mm |
Min. Laser Drill Size | 0.075mm 0.10mm | N/A |
Aspect Ratio | 12:1 | 15:1 |
Min.Trace Width | 0.04mm | 0.03mm |
Min.SMT/QFP Pitch | 0.30mm | 0.25mm |
Min.BGA Pitch | 0.30mm | 0.25mm |
Min.Solder Mask Dam Width | 0.07mm | 0.05mm |
S/M Registration Tolerance | ± 0.035mm | ± 0.025mm |
Trace Width Tolerance | ± 20% | ± 8% |
Drilling Hole to Hole Accuracy | ± 0.05mm | ± 0.03mm |
Routing Edge to Edge Accuracy | ± 0.10mm | ± 0.05mm |
Punching Edge to Edge Accuracy | ± 0.10mm | ± 0.075mm |
V-cut Edge to Edge Accuracy | ± 0.10mm | ± 0.075mm |
PTH Tolerance | ± 0.075mm | ± 0.05mm |
NPTH Tolerance | ± 0.05mm | ± 0.03mm |
Registration(O/L) | ± 0.04mm | ± 0.03mm |
Max.Test Points | 80000 | 100000 |
Impedance Control Tolerance | ± 8% | ± 5% |
Fabrication Standard | IPC-6012/6013/6016 Class2,3 Perfag 2E,3C | |
Surface Treatment | HASL(Pb/Sn or Lead-Free). ENIG(Immersion Gold):Ni≥100U”, Au≥2U”. ENIG + OSP. Hard gold plating: Ni≥100U”, Au≥30U”. Immersion Sliver. Immersion Sn. Peelable glue mask. Carbon ink. |
Capability for FPC, Rigid-Flex
Item | Normal | Speciality |
Layer Count | 1-14L | 1-20L |
Min.Finished Board Thickness | FPC: 0.05mm Rigid-Flex:0.1mm | N/A |
Min.Trace Width | 0.04mm | 0.03mm |
Min.Drill Size | Mech: 0.15mm Laser:0.075mm | N/A |
Min.Cu Thickness (Based) | 12um | 8um |
Molding Tolerance | ± 0.10mm | ± 0.05mm |
Capability for SMT
Item | Normal |
Mount Range | 01005 ~ □32mm Chip、SOP、QFP、CSP、BGA… |
Mount Accuracy Repeatability | ±0.05mm ±0.03mm |
Minimum Substrate | L50mm*W50mm |
Maximum Substrate | L510mm*W460mm |
Mounting Substrate Thickness | 0.5 ~2.6mm |
Technology | Lead Paste Paste Lead-free Dispense |